HELB Opens Undergraduate Subsequent Scholarship and Loan application: Apply
The Higher Education Loans Board (HELB) and the Universities Fund invite applications for the 2024-2025 Financial Year Second and Subsequent Undergraduate Scholarships and Loans.
These are available to Kenyan continuing students who are either placed by the Kenya Universities & Colleges Central Placement Service (KUCCPS) or enrolled in self-sponsored programs at public and private universities in Kenya and within the East African Community.
The institutions must be recognized by the Commission for University Education (CUE).
Eligible Students
The application is open to undergraduate continuing students seeking their second or subsequent scholarships and loans.
How to Apply
To apply for the HELB loans and scholarships, follow these steps:
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- Access the Application Portal:
- Download the HELB App from the Google Play Store or use the USSD Code by dialing *642#.
- Register using your phone number to generate a PIN, which you will use to log in.
- Ensure the mobile number is registered under your name. Mobile numbers not registered in the student’s name will not be able to proceed with the application.
- Registration:
- Enter your first name as it appears on your national ID card, your ID number, and a valid email address to complete the registration.
- Read, understand, and accept the terms and conditions.
- Application Process:
- Click on the “Scholarship or Loans” or “Loans & Scholarship” tab and select “Degree.” Then click “Apply” on the Undergraduate Second and Subsequent Scholarship and Loan option.
- Read and understand the process tutorial, then proceed to read the financial literacy guide. Answer the financial literacy questions, view the results, and click “Proceed.”
- Click on “Get Started” to begin the application process.
- Verification:
- Enter your phone number, which should be registered in your name, and your national ID number to verify ownership.
- Read and understand the scholarship/loan terms and conditions and agree to proceed.
- Submit Application:
- Click “Request Loan” to view and verify your loan details.
- Select your preferred loan payment option and click “Submit” to complete the loan application. A pop-up message will confirm your successful application, displaying the loan serial number.
- Notifications:
- You will receive notifications regarding awards and disbursements of upkeep and tuition loans and, where applicable, bursaries in due course.
Important Notes
- The application process is entirely paperless; there is no need to print any forms.
- A confirmation SMS with a loan application serial number serves as evidence of application. Save this SMS for future reference.
- HELB does not charge any fees to access the loan application.
- The closing date for applications is 31st December 2024.
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For any further assistance, contact HELB at:
- Website: www.helb.co.ke
- Location: Anniversary Towers, University Way
- USSD Code: *642#
- Phone: +254711052000
- Email: [email protected]
HELB Opens Undergraduate Subsequent Scholarship and Loan application: Apply
